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ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System

March 25, 2016 | Comments Off on ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System

ESI’s CornerStone™ ICP platform will facilitate the center’s ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for...
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