Archive for the 'Press Releases' Category
Mar
24
NEI Corporation Extends Its Advanced Materials Capabilities to Develop Fuel Cell Membranes
March 24, 2016 | Comments Off on NEI Corporation Extends Its Advanced Materials Capabilities to Develop Fuel Cell Membranes
Somerset, New Jersey – NEI Corporation announced today that it has started developing polymer electrolyte membranes PEMs) for fuel cells that avoid the use of perfluorosulfonic acid (PFSA) ionomers. PFSA materials, used in state-of-the-art PEM fuel cells, suffer from low proton conductivity at high operating…
Mar
24
UNISIG Spotlights New Drilling System for Aerospace Components at MMTS
March 24, 2016 | Comments Off on UNISIG Spotlights New Drilling System for Aerospace Components at MMTS
MENOMONEE FALLS, Wis. – At the Montreal Manufacturing Technology Show, UNISIG Deep Hole Drilling Systems will present how its new B700 Gap Bed machine effectively generates the critical, high-precision features on large and irregularly shaped aerospace components such as landing gear struts. The company will also…
Mar
24
Microsemi DIGI-G4’s Encryption Engine to Lead Secured Optical Connectivity to the Cloud
March 24, 2016 | Comments Off on Microsemi DIGI-G4’s Encryption Engine to Lead Secured Optical Connectivity to the Cloud
DIGI-G4’s CrypOTN Architecture Awarded FIPS 197 Certification
ALISO VIEJO, Calif. – Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its DIGI-G4, the company’s latest DIGI Optical Transport Network…
Mar
24
ON Semiconductor Takes a Leading Position within APEC 2016
March 24, 2016 | Comments Off on ON Semiconductor Takes a Leading Position within APEC 2016
Multiple seminars during the week alongside several on-booth new technology demonstrations
Applied Power Electronics Conference (APEC) – Booth 1625 – Long Beach, CA – ON Semiconductor (Nasdaq: ON), driving energy efficiency innovations, has announced a significant involvement in APEC 2016, a flagship event for the…
Mar
24
Future Electronics Promotes NXP’s NFC Smart Connected Home Products
March 24, 2016 | Comments Off on Future Electronics Promotes NXP’s NFC Smart Connected Home Products
Pointe Claire, Quebec – Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of NXP’s NFC smart connected home products.
Entertainment systems, lights, thermostats, and even appliances are being connected to the internet. The Internet of Things (IoT…
Mar
24
OFS to Present Live Demonstration of TeraWave(TM) ULL Optical Fiber at OFC 2016
March 24, 2016 | Comments Off on OFS to Present Live Demonstration of TeraWave(TM) ULL Optical Fiber at OFC 2016
ANAHEIM, Calif. – OFC 2016, Booth 2633 — OFS, a leading designer, manufacturer and supplier of innovative fiber optic network products and solutions will showcase a live demonstration using a combination of Ciena’s Waveserver™ stackable interconnect system and OFS’ TeraWave™ ULL fiber, illustrating delivery of…