Archive for the 'Press Releases' Category
Mar
21
IP65 Industrial Panel PC withstands challenging environments.
March 21, 2016 | Comments Off on IP65 Industrial Panel PC withstands challenging environments.
Powered by Intel® Celeron® or Core™ i3/i7 CPU, fanless UPC-V315-QM77 comes in all-metal chassis resistant to ingress of water, dust, and other potentially damaging contaminants and MIL-STD-810F certified for shock an…
Mar
21
Laser Profile Sensors enable precision measurement of small parts.
March 21, 2016 | Comments Off on Laser Profile Sensors enable precision measurement of small parts.
Featuring blue-violet laser diode, scanCONTROL 29xx-10/BL projects 10 mm long laser line at profile resolution of 1,280 measuring points onto measurement object; point distance is 7.8 µm. Use of blue laser light, which does …
Mar
21
Oscilloscope Probes work with smaller, faster designs.
March 21, 2016 | Comments Off on Oscilloscope Probes work with smaller, faster designs.
Minimizing probe loading and improving access to small, densely packed test locations, TriMode™ P7700 series facilitates debugging of circuits found in mobile and enterprise designs. These probes, intended for use with Tektronix performanc…
Mar
21
Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
March 21, 2016 | Comments Off on Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
Covering 5–1,794 MHz range, UltraCMOS® PE42723 comes in 12-lead, 3 x 3 mm QFN package and achieves -121 dBc second harmonic and -140 dBc third harmonic at 17 MHz. This SPDT switch enables dual upstream/downstream band archite…
Mar
21
Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
March 21, 2016 | Comments Off on Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
Covering 5–1,794 MHz range, UltraCMOS® PE42723 comes in 12-lead, 3 x 3 mm QFN package and achieves -121 dBc second harmonic and -140 dBc third harmonic at 17 MHz. This SPDT switch enables dual upstream/downstream band archite…
Mar
21
IC Packaging Design/Analysis Solution offers all necessary tools.
March 21, 2016 | Comments Off on IC Packaging Design/Analysis Solution offers all necessary tools.
Focused on advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs, IC packaging design and analysis solution includes Cadence® OrbitIO™ Interconnect Designer, Cadence System-in-Package (SiP) Layout, and …