Archive for the 'Press Releases' Category
Mar
21
IC Packaging Design/Analysis Solution offers all necessary tools.
March 21, 2016 | Comments Off on IC Packaging Design/Analysis Solution offers all necessary tools.
Focused on advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs, IC packaging design and analysis solution includes Cadence® OrbitIO™ Interconnect Designer, Cadence System-in-Package (SiP) Layout, and …
Mar
21
Rugged Waterproof Fanless PC provides noise-free operation.
March 21, 2016 | Comments Off on Rugged Waterproof Fanless PC provides noise-free operation.
Designed for harsh environments, WPC-725F features power, video, serial, and USB connections coupled through water-tight, locking bayonet style connectors. Internal Intel® Core™ i7-3517UE (2.8 GHz max) mobile processor with 4M Cache is…
Mar
21
Laser Light Source Projectors support modern work styles.
March 21, 2016 | Comments Off on Laser Light Source Projectors support modern work styles.
To keep pace with work environments and support information sharing needs, PJ WXL6280 and PJ WUL6280 have lamp-free design that allows 20,000+ hr of use and HDBaseT interface capable of carrying video, audio, and control signals up to 100 m via …
Mar
21
Transphorm Strengthens Sales Channel with Addition of Richardson Electronics and A/D Sales
March 21, 2016 | Comments Off on Transphorm Strengthens Sales Channel with Addition of Richardson Electronics and A/D Sales
New global distributor and sales representative enhance technical support and supply chain in response to increased customer demand
GOLETA, Calif. – Transphorm Inc., a leader in the design and manufacturing of JEDEC-qualified 650V GaN (gallium nitri…
Mar
21
KEMET to Reveal Advanced Ceramic Capacitor Technology at APEC 2016
March 21, 2016 | Comments Off on KEMET to Reveal Advanced Ceramic Capacitor Technology at APEC 2016
New high-stability dielectric extends application reach of compact, cost-effective class-1 MLCCs
KEMET is to preview new multilayer ceramic capacitors (MLCCs) featuring its advanced U2J Class-1 dielectric technology at the 2016 IEEE Applied Power El…
Mar
21
Altera Targets Next-Gen 500Gbps-1Tb Optical Transport Networks
March 21, 2016 | Comments Off on Altera Targets Next-Gen 500Gbps-1Tb Optical Transport Networks
Altera Targets Next-Gen 500Gbps-1Tb Optical Transport Networks
San Jose, Calif., — Altera, now a part of Intel Corporation, is attending the Optical Fiber Conference being held at the Anaheim Convention Center, in Anaheim, CA, from March 22-24 (Booth #2667), to demonstrate how its programmable chips will help…