Archive for the 'Press Releases' Category
Mar
21
Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
March 21, 2016 | Comments Off on Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
Covering 5–1,794 MHz range, UltraCMOS® PE42723 comes in 12-lead, 3 x 3 mm QFN package and achieves -121 dBc second harmonic and -140 dBc third harmonic at 17 MHz. This SPDT switch enables dual upstream/downstream band archite…
Mar
21
Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
March 21, 2016 | Comments Off on Reflective RF Switch exceeds DOCSIS 3.1 linearity demands.
Covering 5–1,794 MHz range, UltraCMOS® PE42723 comes in 12-lead, 3 x 3 mm QFN package and achieves -121 dBc second harmonic and -140 dBc third harmonic at 17 MHz. This SPDT switch enables dual upstream/downstream band archite…
Mar
21
IC Packaging Design/Analysis Solution offers all necessary tools.
March 21, 2016 | Comments Off on IC Packaging Design/Analysis Solution offers all necessary tools.
Focused on advanced Fan-Out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs, IC packaging design and analysis solution includes Cadence® OrbitIO™ Interconnect Designer, Cadence System-in-Package (SiP) Layout, and …
Mar
21
Transphorm Strengthens Sales Channel with Addition of Richardson Electronics and A/D Sales
March 21, 2016 | Comments Off on Transphorm Strengthens Sales Channel with Addition of Richardson Electronics and A/D Sales
New global distributor and sales representative enhance technical support and supply chain in response to increased customer demand
GOLETA, Calif. – Transphorm Inc., a leader in the design and manufacturing of JEDEC-qualified 650V GaN (gallium nitri…
Mar
21
KEMET to Reveal Advanced Ceramic Capacitor Technology at APEC 2016
March 21, 2016 | Comments Off on KEMET to Reveal Advanced Ceramic Capacitor Technology at APEC 2016
New high-stability dielectric extends application reach of compact, cost-effective class-1 MLCCs
KEMET is to preview new multilayer ceramic capacitors (MLCCs) featuring its advanced U2J Class-1 dielectric technology at the 2016 IEEE Applied Power El…
Mar
21
Altera Targets Next-Gen 500Gbps-1Tb Optical Transport Networks
March 21, 2016 | Comments Off on Altera Targets Next-Gen 500Gbps-1Tb Optical Transport Networks
Altera Targets Next-Gen 500Gbps-1Tb Optical Transport Networks
San Jose, Calif., — Altera, now a part of Intel Corporation, is attending the Optical Fiber Conference being held at the Anaheim Convention Center, in Anaheim, CA, from March 22-24 (Booth #2667), to demonstrate how its programmable chips will help…