Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

February 9, 2016 | Comments Off on Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev. Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder...