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March 31, 2016 | Comments Off on Removable Hot Melt Material streamlines substrate coating.
Formulated to allow accelerated, precise deposition in small areas, slump-resistant Technomelt® AS 8998 is compatible with automated dispensing systems and offers peel-off approach to masking specific components or designated PCB areas that must remain free of any applied protective coatings. This silicone- and halogen-free, RoHS-compliant material, which solidifies upon cooling, ensures accurate coverage only where needed and without any material migration.